High Performance One Component Thermal Gap Filler for PCB CPU

High Performance One Component Thermal Gap Filler for PCB CPU

Thermal Gap Filler is a gel-like thermally conductive filler material made of silica gel compounded with thermally conductive filler, stirred, mixed and encapsulated. It adopts dispensing design, when used with the glue mixing nozzle hit, easy to use and fast, can achieve automatic dispensing production. Thermally conductive gel is divided into one-component and two-component paste, which can fill irregular and complex shapes and small gaps; it provides various thicknesses in gel form, replacing the die-cut thickness of general thermally conductive gaskets. This is the advantage of Thermal Gap Filler over thermal shims.

In addition, the formulation of Thermal Gap Filler is more diverse than that of thermally conductive spacers. The assembly stress of thermal conductive gel is very low, and the expansion coefficient is very small after vulcanisation due to the low hardness, which can improve the stability of the circuit board. While thermal pads will have size failure, cutting edges and other problems during the moulding process, the raw material utilisation rate is low, while the automated dispensing of thermal gel can control the dosage faster and more accurately, and the raw material utilisation rate is high.

1, automotive electronics on the drive module components and heat transfer between the shell.
2, LED bulb light in the drive power.
3, the heat dissipation of the chip. Similar processors and heat sinks in the middle of the silicone layer is the same principle, its role is to allow the processor to emit heat can be more quickly transferred to the heat sink, so as to emit into the air.
5, mobile phone processor cooling. In the processor of the mobile phone will be used on the thermal conductivity gel, will be applied between the chip and the shield, reduce the contact thermal resistance of the chip and the shield, can achieve efficient heat dissipation of the chipset.

A)How could I get a sample?

Before we received the first order, please afford the sample cost and express fee. We will return the sample cost back to you within your first order.

B)Sample time?

Within 15-30 days.

C) Whether you could make our brand on your products?

Yes. We can print your Logo on both the Thermal Gap Filler l and the packages if you can meet our MOQ.

D) Whether you could make your products by our color?

Yes, The color of the Thermal Gap Filler can be customized if you can meet our MOQ.

E) How to guarantee the quality of Thermal Gap Filler?

1) Strict detection during production.

2) Strict sampling inspection on products before shipment and intact product packaging ensured.

F) : Do you accept R & D assignments?

Yes, as long as we can do products, we can according to Your Design Requirements of individual R & D.