Trumony Aluminum Limited
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Description
Vapor Chamber heat spreader are made by sealed copper plates and filled with a small amount of cooling fluid such as de-ionized water that allows heat to be rapidly dispersed away from the source. Inside the chamber resides an internal support structure to prevent the buckling of chamber walls. Classified formally as a heat pipe, a vapor chamber is one of the best heat spreading options at the base of a heatsink; and typically used for high power devices. When combined with stamped fins it creates a high-end thermal management device that can rapidly spread heat from a small source to a large surface area.
A VCH can be integrated with either aluminum or copper heatsink. The simplest method is to solder a vapor chamber to the base of an extruded heatsink. A more thermally efficient method is to solder a stack of stamped fins directly to the surface of a vapor chamber. To improve the dimensional integrity, these fins are often interconnected by locking tabs called zipper fins.
Technical Parameters
| Item | Aluminum Extruded Tube Vapor Chamber |
| Size | Customized , T*W*L |
| Alloy | 1000,3000,5000,7000 |
| Temper | O,H14/H16 |
| Application | CPU radiator, video card, motherboard, power supply, south bridge, north bridge, MOS tube radiator, scientific research, aerospace, led, large heat exchanger radiator, motorcycle and automobile electric equipment transformation. |
